Started: Review the schematic and layout to determine if the board is manufacturable and likely to work; prepare a to-do list of any issues to resolve.
All core design tasks have been completed: we updated the project description with a clear, detailed summary and hashtags; defined and diagrammed the dual-path system architecture (integrated FEM plus discrete splitter/combiner) with a Mermaid chart saved and shared; populated the schematic with the primary FEM IC, ground portal, discrete PA, LNA, RF switch, coupler, voltage regulators, decoupling caps, bias-tee components, matching placeholders, and control-logic devices; added the RP-SMA connector, host RF I/O header, and test points; connected all 50 Ω RF, power, and control nets; reviewed the schematic for missing elements and set all C1–C7 capacitors to 10 V; verified footprints for every part, set the board to a standard 4-layer stackup, defined board dimensions, and placed mounting holes; classified nets by function; and completed part availability checks with MPN assignments and a manufacturability review with an action‐item list.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant