All right, can you help me continue making the project? The last thing I asked for was to change the display, and this is the last message from another thread. The other thread got bugged, and it didn't continue. Can you help me just continue the work from the other session, please?
I can continue from that exact state. I’ll inspect the migrated GDEM0154D67WT subsystem and prior changes, resolve or document the DS1:VPP classification, verify FPC orientation and ERC, then re-place the PCB for the larger panel within the custom 40 × 36 mm watch outline and validate it before routing.
This requires project editing and verification, so please continue in Agent mode.
The ERC fixes, mechanical verification, and PCB re-placement require Agent mode. Click the Continue in Agent Mode button and I’ll resume from the migrated display state.
The display subsystem uses Good Display GDEM0154D67WT as DS1, with active Amphenol F34G-1A7Q1-E8C24 as board connector J1. The previous GDEW0102T4 / 30-pin subsystem is retired from the active design. The watch outline remains 40 × 36 mm; the panel is oriented as 37.32 mm W × 31.80 mm H.
The panel is 200 × 200 pixels with a 27.00 × 27.00 mm active area and 31.80 × 37.32 × 1.00 mm outline. Its interface is a 24-pin, 0.5 mm-pitch FPC. The selected connector is a 24-position, 0.5 mm, right-angle, bottom-contact receptacle; the folded front-contact panel tail faces downward at the PCB connector in the intended watch stack.
GND; no external temperature sensor is fitted, so panel Note 5-6 requires VSS
7
TSDA
GND; no external temperature sensor is fitted, so panel Note 5-6 requires VSS
8
BS1
GND for 4-wire, 8-bit SPI
9
BUSY
Existing EPD_BUSY / MCU PC04; active high
10
RES#
Existing EPD_RESET / MCU PB02
11
D/C#
Existing EPD_DC / MCU PB01
12
CS#
Existing EPD_CS / MCU PA00
13
SCL
Existing SPI_SCLK / MCU PC00
14
SDA
Existing SPI_MOSI / MCU PC01
15
VDDIO
3V3, tied with VCI
16
VCI
3V3
17
VSS
GND
18
VDD
C33, 1 µF / 25 V to GND
19
VPP
Open
20
VSH1
C34, 1 µF / 25 V to GND
21
VGH
C31, 1 µF / 25 V to GND; D8 cathode
22
VSL
C35, 1 µF / 25 V to GND
23
VGL
C36, 1 µF / 25 V to GND; D6 anode
24
VCOM
C37, 1 µF / 25 V to GND
The datasheet defines the pin functions, VDDIO-to-VCI connection, and open-pin requirements. BS1 low selects 4-wire 8-bit SPI, and BUSY is asserted high while the panel is busy. VCI is specified for 2.2–3.7 V operation; the watch uses 3.3 V.
Implemented support circuit
The page-25 reference drawing was copied into the schematic with drawing-only nominal values read directly from the circuit artwork:
Table
Watch ref.
Reference role
Implemented value / part
L5
L1
Taiyo Yuden NRS4018T470MDGJ (Flux UID 31c58a63-2f55-41ff-9b30-1dca8eac9cc0), active exact MPN, 47 µH ±20%, shielded, 0.44 A temperature-rise rating, 0.60 A minimum saturation current, 0.78 Ω maximum DCR, 4.0 × 4.0 × 1.8 mm
Q1
Q1
SI1308EDL-T1-GE3
D6, D7, D8
D1–D3
MBR0530T3G
R16
R1
1 MΩ, 0603, ≥0.05 W
R17
R2
2.2 Ω, 0603, ≥0.05 W
C28
C2
1 µF / 25 V, 0603
C29
C3
4.7 µF / 25 V, 0805, boost flying capacitor
C30
C4
4.7 µF / 25 V, 0805, 3V3 input bypass
C31–C37
C5–C7 and C9–C12
1 µF / 25 V, 0603
The parts table calls for a 47 µH NR3015-class inductor, Si1308EDL-class MOSFET, MBR0530-class diodes, 1% 0603/0805 resistors rated at least 0.05 W, and X5R/X7R 0603/0805 capacitors rated at least 25 V. L5 uses a slightly larger compact equivalent because the named 47 µH NR3015 part has materially lower current capability; NRS4018T470MDGJ provides 0.60 A minimum saturation current in a 4 mm, 1.8 mm-high package. The table independently verifies the Q1 and diode electrical classes.
Implemented booster nets:
3V3 → L5 and C30.
EPD_SW → L5, Q1 drain, D8 anode, C29.
EPD_CP → C29, D6 cathode, D7 anode.
D7 cathode → GND.
D8 cathode → EPD_VGH.
D6 anode → EPD_VGL.
Q1 gate → EPD_GDR; Q1 source → EPD_RESE.
Migration record
Removed: old 30-pin J1; C38–C44; all obsolete EPD_C1P/N through EPD_C6P/N, EPD_VDL, EPD_VDH, EPD_VCOML, EPD_VCOMH, and EPD_BS1 nets.
Reused/reworked: C28–C37, D6, R16, R17.
Added: DS1, new 24-pin J1, Q1, D7, D8, and exact L5 (NRS4018T470MDGJ).
Preserved: MCU nets and pin assignments for SPI MOSI/SCLK, CS, D/C, RESET, and BUSY.
Corrected during final panel-specific verification: restored GND ties on DS1/J1 pins 6 and 7 because GDEM0154D67WT Note 5-6 requires TSCL/TSDA connected to VSS when no external temperature sensor is fitted; confirmed the official Good Display product URL /product/556.html; made resistor tolerances, X7R capacitor dielectric, 25 V ratings, and 0603/0805 packages explicit.
Booster verification: retained NRS4018T470MDGJ, SI1308EDL-T1-GE3, and MBR0530T3G. Their recorded ratings satisfy the panel requirements: L5 is 47 µH with 0.60 A minimum saturation current, Q1 is 30 V with 185 mΩ maximum RDS(on) at 2.5 V gate drive, and D6-D8 are 30 V / 0.5 A Schottky diodes.
Obsolete-interface sweep: no GDEW0102T4, C38-C44, or old 30-pin display nets remain.
Firmware consequences
Firmware must use an SSD1681-compatible 200 × 200 driver, active-high BUSY handling, 4-wire SPI initialization, correct panel waveform/LUT handling, and revised framebuffer/update timing. The operating range is −25 °C to +50 °C and storage range is −25 °C to +70 °C.
Verification status
Pin-by-pin net inspection confirms DS1 and J1 share the preserved MCU nets and the complete booster topology. DS1/J1 pins 6 and 7 are now tied to GND as required by the exact panel specification; DS1 pins 1, 4, and 19 remain intentionally open, and BS1 is grounded for 4-wire SPI. All implemented reference capacitors are ceramic X7R 25 V parts in explicit 0603/0805 packages; the positive/negative internal rails are approximately +20 V/−20 V, so 25 V is the minimum specified rating and should not be reduced. DRC reports no display-part body or copper overlaps after shifting L5 0.15 mm left. ERC has one justified reusable-part typing false positive: the panel datasheet requires DS1 pin 19 VPP to remain open, but the library terminal is typed as a power input, so Power input not connected: DS1:VPP remains and must not be cleared by wiring VPP to a rail. No other display-block ERC finding remains. Remaining release checks are physical: confirm panel-tail contact face, pin-1 orientation, stiffener/fold direction, insertion depth, latch access, service bend radius, and strain relief on production samples before freezing enclosure and connector placement. PCB routing was intentionally not performed.