Review complete. The Datasheet URL was already the official TI PDF, so no update was needed; the symbol pin names/numbers and 21-pad footprint count match the TI TPS61088RHLR / RHL0020A package.
I flagged metadata gaps: pin types are Unspecified, pin descriptions are missing, NC pins should mention TI’s ground-plane thermal recommendation, and the description could clarify “20-pin VQFN with exposed thermal pad / 21 PCB pads.” Full report: tps61088rhlr-part-review.
I’ll update the terminal pin types/descriptions from the TI datasheet, clarify the project/package description, then run a consistency review to verify the part metadata.
Updated all 21 terminals with datasheet-derived pin types and descriptions, normalized types to valid Flux values, and clarified the description as “20-pin VQFN with exposed thermal pad / 21 PCB pads.”
Open items:
The part consistency review tool returned no matching Component Review Checks, so there were no reported issues to remediate.
Manual verification confirms the updated pin metadata is present and pin numbers remain aligned with the TI datasheet.
Suggested next steps:
Re-run the platform review from the UI if you want the full visual check status.
Verify footprint pad geometry against TI RHL0020A land-pattern dimensions if dimensional data is exposed in your footprint editor.
FB: Feedback input; center tap of resistor divider.
COMP: Error amplifier output; compensation network to AGND.
ILIM: Adjustable switch peak-current limit; resistor to AGND.
AGND: Signal ground.
PGND pin 21: Power ground / exposed thermal pad connection; source of low-side MOSFET.
Footprint Cross-Check
The footprint contains 21 pads, matching TI's RHL0020A package convention: 20 perimeter pins plus exposed thermal pad numbered 21. The datasheet package outline is RHL0020A, VQFN, 1 mm max height, body 4.4-4.6 mm × 3.4-3.6 mm, nominal 4.50 mm × 3.50 mm.
Recommended TI land pattern highlights:
20 perimeter pads: 0.6 mm × 0.24 mm
Pin pitch: 0.5 mm
Exposed pad nominal land: approximately 3.05 mm × 2.05 mm
Thermal vias: optional; if used under paste, TI recommends filled/plugged/tented vias
Thermal pad must be soldered to PCB for thermal and mechanical performance
The available layout data confirms pad count and pad designators but did not expose detailed pad geometry in the inspection output, so dimensional land-pattern verification could not be fully confirmed from the returned data.
Mismatches / Issues Flagged
Project description says "20-VFQFN Exposed Pad" while project context says Pads: 21. This is not electrically wrong: TI describes a 20-pin VQFN package with exposed thermal pad numbered 21. For clarity, description could say "20-pin VQFN (RHL) with exposed thermal pad; 21 PCB pads including thermal pad."
All schematic terminal Pin Type properties are currently Unspecified. Datasheet I/O types are available and should be assigned for better ERC/library quality.
No explicit Pin Description properties are present on the terminals. Adding datasheet-derived descriptions would improve symbol usability.
NC_1 and NC_2 are correctly named and numbered, but their descriptions should note TI's recommendation to connect them to the ground plane for thermal dissipation.
Footprint pad count matches the datasheet. Detailed pad dimensions could not be verified from the inspection output; if footprint geometry is editable/visible elsewhere, verify against TI RHL0020A land pattern.
Overall Assessment
The symbol pin names and pin numbers match the official TI TPS61088 datasheet. The footprint pad count matches the 20-pin VQFN with exposed pad convention. Main quality gaps are metadata-level: unspecified pin types, missing pin descriptions, and a description that could more clearly distinguish 20 package leads from 21 PCB pads including exposed pad.