TEC 温控模块设计

当前因账户没有可用 ACUs,我不能继续执行后续修改/检查。
已完成:
  • 删除了独立风扇端子 J3,现在 J2 是TEC+风扇共用输出接口
  • 保留 J4,它是必需的外接 10k B3950 NTC温度探头接口,否则无法按40°C自动启停。
  • 将板框缩小到 60×45mm,改为 2oz铜厚,并把DC座区域重新布局。
  • 将保险丝升级为 MF-R1100 11A保持电流PTC,按8A目标更新了关键电流路径。
  • 已开始手动补关键8A大电流走线,但还没有完成最终DRC清理和制造文件重新导出。
剩余工作:
  • 清理当前仍可能存在的空气线/铜重叠问题。
  • 确认DC圆孔座是否确实已达到你要的180°方向和插头无阻挡。
  • 完成低电流信号线布线。
  • 重新跑DRC/ERC。
  • 重新导出嘉立创用 Gerber / BOM / 坐标文件。
  • 写一份嘉立创EDA/JLCPCB下单说明。
当前不能运行PCB分析或自动布局:你的账户当前没有可用 ACUs,AI执行功能暂时不可用,所以我不能读取/修改当前板子、调用自动布局或应用结果。
目前项目状态总结:
  • 已从原方案改为 12V模拟温控TEC手机散热控制板
  • 控制逻辑:NTC测温,约40°C开启,带回差后关闭,无MCU/无烧录。
  • 输出接口已合并:J2 = TEC + 风扇共用输出
  • J3 已删除
  • J4 保留为10k B3950 NTC温度探头接口,这是温控必需接口。
  • 板框已尝试缩小到约 60×45mm
  • 目标电流已提升到 8A冗余,并考虑你可能使用 12V 10A DC电源
  • 大电流通道、DC座方向、完整布线和最终DRC仍需要继续完成。
待ACUs恢复后,需要执行:
  1. 检查当前PCB是否主要缺布局、布线,或两者都需要。
  2. 旋转/确认DC圆孔座方向,确保插头入口不被元件遮挡。
  3. 重新紧凑摆放输入、保护、MOSFET、输出端子和NTC接口。
  4. 完成8A电流路径布线/铺铜。
  5. 完成信号线布线。
  6. 跑DRC并修复错误。
  7. 重新导出嘉立创/JLCPCB制造文件。
Run schematic check
Review BOM
Shrink board safely
F1 2 - D1 K
F1 2 - D1 K
R2 P2 - R3 P1
J1 ~ - F1 1
J1 ~ - F1 1
R8 P2 - D3 A
U1 OUTPUTA - R5 P2
F1 2 - D1 K
R1 P2 - RT1 P1
U1 OUTPUTA - R5 P2
U1 OUTPUTA - R5 P2
R1 P2 - RT1 P1
Q1 D_7 - J2 PIN2
R2 P2 - R3 P1
F1 2 - D1 K
Q1 D_7 - J2 PIN2
R8 P2 - D3 A
Q1 D_2 - Q1 D_3
F1 2 - D1 K
R2 P2 - R3 P1
Q1 D_7 - J2 PIN2
R7 P2 - R6 P1
R2 P2 - R3 P1
R7 P2 - R6 P1
R1 P2 - RT1 P1
U1 OUTPUTA - R5 P2
F1 2 - D1 K
F1 2 - D1 K
R1 P2 - RT1 P1
F1 2 - D1 K
R7 P2 - R6 P1
Q1 D_2 - Q1 D_3
R1 P2 - RT1 P1
F1 2 - D1 K
Q1 D_7 - J2 PIN2
F1 2 - D1 K
F1 2 - D1 K
R5
Resistance
47kΩ
C1
Capacitance
470uF
J1
Q1 S_3 - R3 P2
R2
Resistance
100kΩ
Q1 S_3 - R3 P2
R6
Resistance
100kΩ
J1 ~ - D1 A
Q1 S_3 - R3 P2
GND
C3
Capacitance
100nF
C2
Capacitance
100nF
J1 ~ - D1 A
RT1
Resistance
10kΩ
Q1 S_3 - R3 P2
R4
Resistance
680kΩ
Q1 S_3 - R3 P2
R7
Resistance
100Ω
Q1 S_3 - R3 P2
Q1 S_3 - R3 P2
R3
Resistance
56kΩ
J1 ~ - D1 A
J1 ~ - D1 A
GND
J1 ~ - D1 A
R8
Resistance
2.2kΩ
R1
Resistance
10kΩ
D2
Q1
J2
D3
U1
J4
F1
D1

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Project Specification
Project Overview
Status: Draft schematic in progress.
This project is a 12V analog temperature-controlled TEC phone cooler controller. It switches a thermoelectric cooler (TEC) and fan at full power when a thermistor attached to a phone back/edge exceeds about 40°C, without any MCU or firmware.
Intended Use
  • Prototype module for intermittent outdoor phone cooling.
  • Intended load: external 12V TEC cooling assembly and 12V fan.
  • Normal power source: external 12V DC barrel-jack adapter, recommended 12V 5A.
  • User is a beginner builder, so the design avoids programming and USB interfaces.
What the Device Should Do
  • Sense phone surface temperature using an external 10k NTC B3950 probe.
  • Turn TEC and fan fully ON when temperature rises above about 40°C.
  • Turn TEC and fan OFF after cooling below the hysteresis point, calculated near 35.3°C with the initial resistor values.
  • Fail safe for open thermistor: TEC remains OFF.
  • Provide visual status LED when cooling output is active.
Main Features
  • 12V DC input through 5.5mm/2.1mm barrel jack.
  • Input overcurrent and transient protection.
  • LM393-class analog comparator; no MCU and no firmware.
  • Low-side logic-level MOSFET switching for TEC and fan outputs.
  • Separate screw terminals for TEC and fan.
  • JST-XH 2-pin connector for external NTC probe.
System Architecture

Diagram


12V DC adapter Input protection 12V protected rail TEC output terminal Fan output terminal Low-side N-MOSFET 10k NTC probe LM393 comparator with hysteresis Ground
Hardware Subsystems
  • Power input: DC-005 barrel jack, 12V nominal, target 5A adapter.
  • Protection: 5A resettable fuse and SMAJ13CA TVS on protected 12V rail.
  • Sensor: external 10k B3950 NTC; open sensor drives sense node high and keeps output off.
  • Comparator: LM393 powered from 12V; reference divider sets approximately 40°C trip with hysteresis.
  • Comparator threshold values: with R1=10k pull-up, external RT1=10k B3950 NTC, R2=100k, R3=56k, and R4=680k hysteresis, the calculated turn-on threshold is about 40.6°C and turn-off threshold is about 35.3°C.
  • Output switch: low-RDS(on) N-channel MOSFET for TEC and fan low-side return.
  • Fan transient protection: Schottky diode across switched load rail.
Interfaces and Connections

Table


InterfaceConnectorNotes
12V input5.5/2.1mm DC barrel jackCenter-positive assumed
TEC output2-pin screw terminal12V+ and switched negative
Fan output2-pin screw terminal12V+ and switched negative
NTC sensor2-pin JST-XHExternal 10k B3950 probe
Power and Runtime Expectations
  • Recommended adapter: 12V 5A.
  • Target maximum board-switched load: up to about 5A combined TEC + fan.
  • Comparator/control current is negligible relative to TEC load.
  • TEC can run at 100% duty if the external TEC module, fan, adapter, wiring, MOSFET copper, and heatsink are sized for continuous current.
Power Tree and Power Budget

Table


RailLoadTypicalPeak / Design
12V protectedTEC moduleTBD by purchased module4.5A target max
12V protectedFan0.1-0.3A typical0.5A design
12V protectedComparator + dividers + LED40°C full-power cooling.
  • Project Overview

  • Intended Use

  • What the Device Should Do

  • Main Features

  • System Architecture

  • Hardware Subsystems

  • Interfaces and Connections

  • Power and Runtime Expectations

  • Power Tree and Power Budget

  • Manufacturing and Assembly Expectations

  • Firmware-Relevant Hardware Requirements

  • Physical Design Expectations

  • Important Design Decisions

  • Assumptions

  • Change Notes

Assets

Assets are files uploaded to this project which can be used in various ways.

12V TEC Phone Cooler 29d1 192c thumbnail
12V analog temperature-controlled TEC phone cooler: NTC sensor switches a TEC and fan at about 40°C using a comparator, with DC input protection and no MCU/firmware.

Properties

Properties describe core aspects of the project.

Pricing & Availability

Distributor

Qty 1

Arrow

$1.42–$3.05

Digi-Key

$0.46

HQonline

$0.16–$0.36

LCSC

$3.52–$3.85

Mouser

$6.86–$7.18

TME

$2.19–$2.21

Verical

$0.62–$68.91

Controls