• Terminal
    Terminal
    An electrical connector acting as reusable interface to a conductor and creating a point where external circuits can be connected.
  • Ground
    A common return path for electric current. Commonly known as ground.
  • Net Portal
    A net identifier used to create connectivity to other Net Portal with the same designator. #portal
  • Power Net Portal
    Power net portal is a special schematic object used to define a power or ground net. Power ports allow you to conveniently indicate a power net at any location in the design. Power nets of the same designator automatically connect throughout your design #portal #power
  • Generic Resistor
    A generic fixed resistor for rapid developing circuit topology. Save precious design time by seamlessly add more information to this part (value, footprint, etc.) as it becomes available. Standard resistor values: 1.0Ω 10Ω 100Ω 1.0kΩ 10kΩ 100kΩ 1.0MΩ 1.1Ω 11Ω 110Ω 1.1kΩ 11kΩ 110kΩ 1.1MΩ 1.2Ω 12Ω 120Ω 1.2kΩ 12kΩ 120kΩ 1.2MΩ 1.3Ω 13Ω 130Ω 1.3kΩ 13kΩ 130kΩ 1.3MΩ 1.5Ω 15Ω 150Ω 1.5kΩ 15kΩ 150kΩ 1.5MΩ 1.6Ω 16Ω 160Ω 1.6kΩ 16kΩ 160kΩ 1.6MΩ 1.8Ω 18Ω 180Ω 1.8KΩ 18kΩ 180kΩ 1.8MΩ 2.0Ω 20Ω 200Ω 2.0kΩ 20kΩ 200kΩ 2.0MΩ 2.2Ω 22Ω 220Ω 2.2kΩ 22kΩ 220kΩ 2.2MΩ 2.4Ω 24Ω 240Ω 2.4kΩ 24kΩ 240kΩ 2.4MΩ 2.7Ω 27Ω 270Ω 2.7kΩ 27kΩ 270kΩ 2.7MΩ 3.0Ω 30Ω 300Ω 3.0KΩ 30KΩ 300KΩ 3.0MΩ 3.3Ω 33Ω 330Ω 3.3kΩ 33kΩ 330kΩ 3.3MΩ 3.6Ω 36Ω 360Ω 3.6kΩ 36kΩ 360kΩ 3.6MΩ 3.9Ω 39Ω 390Ω 3.9kΩ 39kΩ 390kΩ 3.9MΩ 4.3Ω 43Ω 430Ω 4.3kΩ 43KΩ 430KΩ 4.3MΩ 4.7Ω 47Ω 470Ω 4.7kΩ 47kΩ 470kΩ 4.7MΩ 5.1Ω 51Ω 510Ω 5.1kΩ 51kΩ 510kΩ 5.1MΩ 5.6Ω 56Ω 560Ω 5.6kΩ 56kΩ 560kΩ 5.6MΩ 6.2Ω 62Ω 620Ω 6.2kΩ 62KΩ 620KΩ 6.2MΩ 6.8Ω 68Ω 680Ω 6.8kΩ 68kΩ 680kΩ 6.8MΩ 7.5Ω 75Ω 750Ω 7.5kΩ 75kΩ 750kΩ 7.5MΩ 8.2Ω 82Ω 820Ω 8.2kΩ 82kΩ 820kΩ 8.2MΩ 9.1Ω 91Ω 910Ω 9.1kΩ 91kΩ 910kΩ 9.1MΩ #generics #CommonPartsLibrary
  • Generic Capacitor
    A generic fixed capacitor for rapid developing circuit topology. Save precious design time by seamlessly add more information to this part (value, footprint, etc.) as it becomes available. Standard capacitor values: 1.0pF 10pF 100pF 1000pF 0.01uF 0.1uF 1.0uF 10uF 100uF 1000uF 10,000uF 1.1pF 11pF 110pF 1100pF 1.2pF 12pF 120pF 1200pF 1.3pF 13pF 130pF 1300pF 1.5pF 15pF 150pF 1500pF 0.015uF 0.15uF 1.5uF 15uF 150uF 1500uF 1.6pF 16pF 160pF 1600pF 1.8pF 18pF 180pF 1800pF 2.0pF 20pF 200pF 2000pF 2.2pF 22pF 20pF 2200pF 0.022uF 0.22uF 2.2uF 22uF 220uF 2200uF 2.4pF 24pF 240pF 2400pF 2.7pF 27pF 270pF 2700pF 3.0pF 30pF 300pF 3000pF 3.3pF 33pF 330pF 3300pF 0.033uF 0.33uF 3.3uF 33uF 330uF 3300uF 3.6pF 36pF 360pF 3600pF 3.9pF 39pF 390pF 3900pF 4.3pF 43pF 430pF 4300pF 4.7pF 47pF 470pF 4700pF 0.047uF 0.47uF 4.7uF 47uF 470uF 4700uF 5.1pF 51pF 510pF 5100pF 5.6pF 56pF 560pF 5600pF 6.2pF 62pF 620pF 6200pF 6.8pF 68pF 680pF 6800pF 0.068uF 0.68uF 6.8uF 68uF 680uF 6800uF 7.5pF 75pF 750pF 7500pF 8.2pF 82pF 820pF 8200pF 9.1pF 91pF 910pF 9100pF #generics #CommonPartsLibrary
  • Generic Inductor
    A generic fixed inductor for rapid developing circuit topology. *You can now change the footprint and 3D model at the top level anytime you want. This is the power of #generics
  • RMCF0805JT47K0
    47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film #forLedBlink
  • 875105359001
    10uF Capacitor Aluminum Polymer 20% 16V SMD 5x5.3mm #forLedBlink #commonpartslibrary #capacitor #aluminumpolymer #radialcan
  • CTL1206FYW1T
    Yellow 595nm LED Indication - Discrete 1.7V 1206 (3216 Metric) #forLedBlink
J1

Severe Apricot Electromagnetic Shrinking Machine

Severe Apricot Electromagnetic Shrinking Machine
Description

Created
Last updated by 2w2w
1 Contributor(s)
2w2w

Controls

Properties

Availability & Pricing

DistributorQty 1
LCSC$0.96

Assets

    Simulation

    µs

    Simulation Speed

    Test Plan Development Guide

    Create a comprehensive test plan for this project. Define the testing scope, objectives, and key functional and non-functional requirements to be validated. Outline different test categories (e.g., Electrical Testing, Thermal Testing, Mechanical Testing, Environmental Testing, Communication & Interface Testing) and specify test cases, expected outcomes, and pass/fail criteria. If applicable, include test environment setup, automation strategies, edge cases, and potential risks. Provide recommendations for improving test coverage and ensuring reliability.

    Using

    General
    Project Schematic
    Below is an example of a comprehensive test plan document that you could use for a project like this. You can adjust or expand the details as necessary:

    Project Test Plan
    Project: Severe Apricot Electromagnetic Shrinking Machine

    1. Introduction
    This test plan outlines the procedures and strategies for verifying the design and functionality of the project. It defines the testing scope, objectives, and key functional and non-functional requirements. The plan also delineates different test categories, test cases, expected outcomes, pass/fail criteria, test environment setup, automation strategies, identified edge cases, and potential risks.

    2. Testing Scope
    Scope Includes:
    • Verification of circuit functions including battery charging, boost operation, and power management using the BQ25895 IC.
    • Verification of electrical performance including voltage regulation, noise/decoupling, and current limit functionality.
    • Mechanical and environmental assessments of board mounting, connectors, and overall assembly reliability.
    • Communication and interface verification for I²C and other control signals.
    Out-of-Scope:
    • Complete PCB fabrication or final assembly stress tests (beyond pre-manufacturing DRC and simulation phases).
    • In-depth system-level integration with external peripherals, unless specifically outlined.

    3. Test Objectives
    • Verify Functional Correctness: Confirm that the circuit operates per the intended design specifications (e.g., correct charging voltage, proper signal routing on I²C lines).
    • Ensure Electrical Safety and Reliability: Validate that all electrical parameters (e.g., decoupling capacitor placement and resistor ratings) are within safe operational limits.
    • Evaluate Environmental Robustness: Test device performance under temperature, humidity, and vibration conditions to simulate real-world operating scenarios.
    • Confirm Communication Integrity: Verify that communication interfaces between the BQ25895 and the host controller function without errors.

    4. Key Requirements Functional Requirements
    • Battery Charger Operation:
      • The charging IC must regulate the battery charge within specified voltage and current limits per the datasheet.
    • Signal Integrity:
      • Communication lines (I²C, status outputs) must maintain integrity over the expected operating range.
    • Power Distribution:
      • Proper decoupling and bypass capacitors are required at each power node.
    Non-Functional Requirements
    • Reliability & Durability:
      • The circuit must maintain stable operation under continuous use and multiple charge/discharge cycles.
    • Thermal Performance:
      • Components should not exceed their temperature ratings during peak operation.
    • Interference Tolerance:
      • The design should be resilient to common-mode and electromagnetic interference.
    • Manufacturability:
      • The design must meet the design rule checks (DRC) and footprint assignments to ease PCB fabrication.

    5. Test Categories and Cases

    Table


    Test CategoryTest Case DescriptionExpected OutcomePass/Fail Criteria
    Electrical TestingVerify input voltage stability at VBUS, SYS, BAT, and SW pinsVoltage levels must be within the limits specified in the datasheetMeasured voltage deviation within ±5% of target values
    Verify proper functionality of decoupling capacitors (e.g., [C1])No significant voltage ripple detected; noise filtered outRipple < specified threshold (typ. <50mV peak-to-peak)
    Validate battery charging current and voltage profilesCharging current and voltage should follow the expected curvesCurve matches datasheet characteristics
    Thermal TestingPerform thermal imaging during peak load operationIdentify any hotspots; temperatures remain below component ratingsMaximum temperature remains below datasheet max ratings
    Run temperature chamber tests simulating low and high ambient tempsDevice functionality maintained over temperature rangeNo functional degradation from -20°C to +70°C (example)
    Mechanical TestingAssess solder joint reliability and board mounting robustnessSolder joints remain intact; board withstands mechanical shock/vibrationNo mechanical failures after defined test cycles
    Environmental TestingPerform humidity soak testsNo corrosion or leakage in solder joints or componentsVisual inspection and electrical continuity unaffected
    Vibration testing per relevant industry standardThe board remains operational under mechanical vibration stressesNo intermittent or persistent faults reported
    Communication & Interface TestingValidate I²C signal integrity between the BQ25895 and microcontrollerI²C bus communication is error-free; proper pull-up resistors in placeSuccessful data transfers over extended operation times
    Test status indicators and interrupt signals on STAT and INT pinsCorrect signal levels indicating operational statesLogic high/low thresholds maintained as per spec

    6. Test Environment Setup
    • Equipment Needed:
      • Power supplies and multimeters
      • Oscilloscope for waveform analysis
      • Thermal imaging camera
      • Temperature and humidity chamber
      • Vibration simulator
      • I²C protocol analyzer
    • Test Bench Configuration:
      • Test fixture with secure board mounting
      • Automated scripts for cycling power and reading sensor outputs where applicable

    7. Automation Strategies
    • Test Script Automation:
      • Develop automation scripts to cycle the charger and log measurements (voltage, current, temperature).
    • Data Logging:
      • Utilize data acquisition systems to continuously log environmental parameters during tests.
    • I²C Communication Automation:
      • Script I²C bus monitoring to check for communication errors over a long duration.

    8. Edge Cases and Potential Risks
    • Edge Cases:
      • Operation at the extremes of voltage and temperature ranges
      • Fast transient events causing momentary voltage dips or spikes
      • Intermittent I²C communication errors due to noise in a cluttered environment
    • Potential Risks:
      • Component stress due to prolonged thermal cycling may lead to premature failure
      • Misplaced or incorrect passive component values causing noisy or unstable operation
      • External electromagnetic interference affecting signal integrity

    9. Recommendations for Improving Test Coverage and Reliability
    • Increase Test Resolution:
      • Use high-precision measurement instruments to capture small deviations.
    • Simulate Real-world Scenarios:
      • Include tests that mimic real user load conditions and environmental stressors.
    • Regular Automated Regression Tests:
      • Embed test scripts in the workflow to run automatically after design updates.
    • Peer Reviews and Cross-Verification:
      • Have the test plan and results reviewed by separate teams to ensure objective validation.
    • Document Deviations:
      • Maintain detailed records of any deviations encountered during testing and their impact on system performance to guide design refinements.

    This plan serves as a starting point. You can refine each section based on the current project specifications and testing resources available, ensuring that all critical aspects of reliability, performance, and safety are thoroughly validated.
    Project Properties Setup
    Select Additional Components
    Update Project Description
    hy i want to make powerbank using bq25895 and capacity upto 30000mah output voltage type c

    Using

    General
    Chat History
    Project Schematic
    To better understand your design intent, I have 3 short questions. Let's start with the first one:
    1. Do you plan to use a single-cell battery (with parallel cells for increased capacity) – which is typical for the BQ25895 – or are you considering a different battery configuration to achieve 30000 mAh?
    Confirm Battery Configuration
    Multiple Parallel Cells
    Single-cell battery configuration.

    Using

    General
    Chat History
    Project Schematic
    1. What output current rating do you require for the USB Type-C port (e.g., 5V/2A, 5V/3A)?
    2. Do you plan to incorporate any additional features, like a fuel gauge or pass-through charging, into the design?
    Output current rating
    Additional Feature Fuel Gauge
    Additional Feature Pass-through Charging
    5V/3A.

    Using

    General
    Chat History
    Project Schematic
    1. Would you like to incorporate any additional features such as a fuel gauge or pass-through charging into your design?
    Include fuel gauge
    Include pass-through charging
    Basic design
    Add a fuel gauge for accurate battery level monitoring.

    Using

    General
    Chat History
    Project Schematic
    Based on your responses, your design will be a powerbank using the BQ25895 in a single-cell battery configuration, delivering 5V/3A via a USB Type-C port, and incorporating a fuel gauge for accurate battery level monitoring.
    Would you like to update the project properties with these design specifications?
    Update project properties
    Select main fuel gauge IC
    Begin schematic development with current specs
    Update the project description to reflect the specifications for a single-cell power bank with a 30,000mAh capacity, a USB-C output of 5V/3A, and a fuel gauge.

    Using

    General
    Chat History
    Project Schematic
    Code Interpreter
    The project description has been updated to reflect a single-cell power bank design with a 30,000 mAh capacity, a USB-C output of 5V/3A, and the inclusion of a fuel gauge for accurate battery level monitoring.
    What would you like to work on next?
    Add fuel gauge IC
    Decoupling capacitors
    USB-C components
    List the recommended decoupling capacitors for the BQ25895 and add them to my schematic.

    Using

    General
    Chat History
    Project Schematic
    Library
    The BQ25895 datasheet recommends the following decoupling strategy:
    • High-Frequency Decoupling:
      Use one 100nF ceramic capacitor (typically in a 0402 package) placed as close as possible to the VBUS (and/or SYS) pin to filter high-frequency noise. For example, you can use the 100nF 0402 capacitor.
    • Bulk Decoupling:
      In addition, a 10µF capacitor (typically in a 0603 package) is recommended to provide bulk decoupling for stability under load transients. An option is the 10uF 0603 Capacitor.
    I will add these decoupling capacitors to your schematic near the appropriate nodes of the BQ25895: one 100nF capacitor for high-frequency bypassing at the VBUS pin and one 10µF capacitor for bulk decoupling at the supply input.
    Add 100nF capacitor
    Add 10uF capacitor
    Capacitor values verification

    Checks that the power traveling across a given resistor is under its rating with 50% headroom.
    Learn more
    Checks that IC pins that require pull up or pull down resistors have them.
    Learn more
    Checks that capacitors have appropriate voltage ratings to prevent overheating and ensure reliable circuit operation.
    Checks that all parts have a part number and are available from distributors.
    Reports issues with Auto-Layout if Copilot cannot route something or must ignore a configuration.
    Reports copper elements that are shorting.
    Reports parts that have no footprint.
    Reports nodes that are assigned to a layer that doesn't exist in the layout stackup.
    Reports components that have been modified using the "!important" flag.
    Reports terminals that are not connected properly. NOTE: Only connections to the center of pads are considered valid.
    Reports nodes that are using rules that are not supported anymore.
    Reports layers that have multiple copper fills of different nets. Make sure the Connected Layers rule value of nets with fills is valid.
    Detect any via, trace or copper fill island that is not connected to any net.